The failure analysis and lifetime prediction for the solder joint of the magnetic head Xiao,XH en Peng,MF en Jaime Cardoso en Tang,RJ en Zhou,YL en 2018-01-14T21:01:18Z 2018-01-14T21:01:18Z 2015 en
dc.description.abstract Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 A degrees C is 0.015354; the solder lifetime t is 14.46 years . en
dc.identifier.uri en
dc.language eng en
dc.relation 3889 en
dc.rights info:eu-repo/semantics/openAccess en
dc.title The failure analysis and lifetime prediction for the solder joint of the magnetic head en
dc.type article en
dc.type Publication en
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